Referenced Items are not available for this document.
The morphological features of the crescent bond footprints on the substrate after peeling the wire off were studied to gain an understanding of the effect of process parameters on the crescent bond formation. In the absence of any ultrasonic energy, metallurgical bonding initiated at the peripheral regions of the crescent bond. The bond strength improved at higher substrate temperatures and higher bonding force which promoted higher shear deformation of the substrate. The application of ultrasonic energy drastically improved the growth of micro welds along the bond interface and produced micro weld patterns on the footprint that are characteristic of the level of ultrasonic energy applied. The effect of these process parameters on the mechanisms of crescent bonding are discussed.
Published in:
Components and Packaging Technologies, IEEE Transactions on
(Volume:28
,
Issue:
4
)
Date of Publication: Dec. 2005
- Page(s):
- 810 - 816
- ISSN :
- 1521-3331
- INSPEC Accession Number:
- 8675102
- Digital Object Identifier :
- 10.1109/TCAPT.2005.848585
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 05 December 2005
- Issue Date :
- Dec. 2005
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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