Cart (Loading....) | Create Account
Close category search window

Development of two dimensional scanner-on-scanner for confocal laser scanning microscope "LEXT" series

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

A two dimensional (2-D) Scanner-on-scanner (SOS) has been developed for commercial confocal laser scanning microscope (LSM) "LEXT' series. The SOS consists of a newly developed electromagnetic MEMS scanner mounted on a commercially available galvanometric scanner, being inclined at 45deg. The SOS realizes much smaller distortion in the 2-D scanning pattern than that obtained by gimbaled type MEMS 2-D scanner. Key issue is miniaturizing the MEMS scanner so that it can be mounted onto the galvanometric scanner. It was realized by using a coil for both driving and sensing so that sensing output was increased, and thus size reduction of permanent magnets have become possible, leading to the scanner volume of approximately 9.3 % of the one previously developed for a LSM, Olympus OLS1200

Published in:

Optical MEMS and Their Applications Conference, 2005. IEEE/LEOS International Conference on

Date of Conference:

1-4 Aug. 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.