By Topic

A study of outgassing from spin-on-glass films used for planarization

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Kobayakawa, M. ; Process Technol. Center, OKI Electr. Ind. Co. Ltd., Tokyo, Japan ; Arimatsu, A. ; Yokoyama, F. ; Hirashita, N.
more authors

The outgassing from phosphorus doped spin-on-glass (SOG) film was investigated by thermal desorption spectroscopy (TDS). Water and hydrocarbon were found to be main outgassing species from SOG films. Water desorption from SOG films is classified into three components and two hydrocarbon desorption peaks are also observed. The results reveal that water desorption are related to P-OH and Si-OH components in SOG films. It is necessary to optimize cure condition and phosphorus concentration in SOG films for highly reliable multi-level interconnects

Published in:

VLSI Multilevel Interconnection Conference, 1991, Proceedings., Eighth International IEEE

Date of Conference:

11-12 Jun 1991