The material characteristics of a new methyl-phenyl silsesquioxane spin-on glass for use in a global nonetchback interconnect planarization process

A new methyl-phenyl silsesquioxane SOG, GR 720, has been successfully used for a global, nonetchback intermetal planarization process. A double coat of GR 720 SOG is capable of filling submicron features with aspect ratios greater than 6, also producing global planarization without gaps, voids or cracks. The dielectric constant of GR 720 after a 400 degrees C thermal cure was determined to be 2.9 at 1 MHz as measured by C-V techniques. TGA analysis demonstrates that the GR 720 SOG material is stable to 500 degrees C. DSC analysis indicates that the solvents are removed at 130 degrees C with no additional material evolution up to 500 degrees C.<
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