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Step coverage evaluation of copper films prepared by magnetron sputtering

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3 Author(s)
Park, Y.H. ; Process Lab., ULVAC North America Corp., Fremont, CA, USA ; Chung, A.H. ; Ward, M.A.

Sputtered copper was investigated with emphasis on step coverage over difficult 1 μm via holes with aspect ratio of unity. The bottom filling in the hole was greater with Cu when compared with aluminum. Cu sidewall coverage was continuous without voids. Results are discussed in terms of the angular distribution of sputtered Cu and Al and relative mass to argon. Other physical properties of Cu are presented

Published in:

VLSI Multilevel Interconnection Conference, 1991, Proceedings., Eighth International IEEE

Date of Conference:

11-12 Jun 1991