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This paper presents the application of a fast and accurate layout-level statistical analysis methodology for the diagnosis of RF circuit layouts with embedded passives in liquid crystalline polymer substrates. The approach is based on layout-segmentation, lumped-element modeling, sensitivity analysis, and extraction of probability density function using convolution methods. The statistical analyses were utilized as a diagnosis tool to estimate distributed design parameter variations and yield of RF circuit layouts for a given measured performance. The results of statistical analysis and diagnosis were compared with measurement results of fabricated filters. Statistical methods were also applied for design space exploration to improve system performance, as well as estimation of yield and diagnosis of faults during batch fabrication.