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A time-domain surface integral technique for mixed electromagnetic and circuit simulation

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2 Author(s)
Chuanyi Yang ; Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA ; Jandhyala, V.

This paper presents a coupled simulation approach in the time domain for modeling nonlinear circuits, electromagnetic components, and electromagnetic interference (EMI) interactions together in one integrated methodology. The approach is based on a rigorous coupling of circuit simulation and time-domain integral equation simulation. The method obviates the need for circuit realizations of electromagnetic interactions, and can be considered complementary to the partial element equivalent circuits, for cases where surface-based modeling is preferable such as complex connectors and packages, and for Green's function based modeling of skin effects.

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Advanced Packaging, IEEE Transactions on  (Volume:28 ,  Issue: 4 )