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Dynamic compact thermal models with multiple power sources: application to an ultrathin chip stacking technology

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4 Author(s)
Palacin, J. ; Sistemes d''Instrum.acio i Comunicacions, Univ. de Barcelona, Spain ; Salleras, M. ; Samitier, J. ; Marco, S.

Whereas numerical modeling using finite-element methods (FEM) can provide transient temperature distribution in the component with enough accuracy, it is of the most importance the development of compact dynamic thermal models that can be used for electrothermal simulation. While in most cases single power sources are considered, here we focus on the simultaneous presence of multiple sources. The thermal model will be in the form of a thermal impedance matrix containing the thermal impedance transfer functions between two arbitrary ports. Each individual transfer function element Hij(s) is obtained from the analysis of the thermal temperature transient at node "i" after a power step at node "j." Different options for multiexponential transient analysis are detailed and compared. Among the options explored, small thermal models can be obtained by constrained nonlinear least squares (NLSQ) methods if the order is selected properly using validation signals. The methods are applied to the extraction of dynamic compact thermal models for a new ultrathin chip stack technology (UTCS).

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:28 ,  Issue: 4 )