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Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low-tolerance embedded capacitors fabrication in organic substrates

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7 Author(s)
Sung-Dong Cho ; Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea ; K. -W. Jang ; Jin-Gul Hyun ; Sangyong Lee
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Epoxy/BaTiO3 composite embedded capacitor films (ECFs) were newly designed for high dielectric constant and low-tolerance (less than ±5%) embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of a specially formulated epoxy resin and latent curing agent, and in terms of a coating process, a comma roll coating method is used for uniform film thickness in large area. The dielectric constant of ECF in high frequency range (0.5∼3 GHz) is measured using the cavity resonance method. In order to estimate dielectric constant, the reflection coefficient is measured with a network analyzer. The dielectric constant is calculated by observing the frequencies of the resonant cavity modes. Calculated dielectric constants in this frequency range are about 3/4 of the dielectric constants at 1 MHz. This difference is due to the decrease of the dielectric constant of the epoxy matrix. The dielectric relaxation of barium titanate (BaTiO3: BT) powder is not observed within measured frequency. An alternative material for embedded capacitor fabrication is epoxy/BaTiO3 composite embedded capacitor paste (ECP). It uses similar materials formulation like ECF and a screen printing method for film coating. The screen printing method has the advantage of forming a capacitor partially in the desired part. However, the screen printing makes surface irregularities during mask peel-off. Surface flatness is significantly improved by adding some additives and by applying pressure during curing. As a result, a dielectric layer with improved thickness uniformity is successfully demonstrated. Using epoxy/BaTiO3 composite ECP, a dielectric constant of 63 and specific capacitance of 5.1 nF/cm2 were achieved.

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:28 ,  Issue: 4 )