Cart (Loading....) | Create Account
Close category search window
 

Passivity verification in delay-based macromodels of electrical interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Gad, Emad ; Univ. of Ottawa, Ont., Canada ; Changzhong Chen ; Nakhla, M. ; Achar, R.

This paper presents a new theory that addresses the issue of passivity in macromodels of electrical interconnects constructed based on the method of characteristics (MoC). The proposed approach develops a new algebraic test to check for passivity in macromodels generated using MoC. The theory behind the developed test is based on deriving the necessary and sufficient conditions for the loss of positive-realness in the admittance matrix of the developed macromodel. An algorithmic procedure is proposed to verify passivity of general macromodels derived from the MoC. The results presented in this paper can be employed to test for positive-realness in dynamical systems described by algebraic delay-differential equations with discrete commensurate delays.

Published in:

Circuits and Systems I: Regular Papers, IEEE Transactions on  (Volume:52 ,  Issue: 10 )

Date of Publication:

Oct. 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.