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Application of eddy-current testing technique for high-density double-Layer printed circuit board inspection

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5 Author(s)
Chomsuwan, K. ; Inst. of Nature & Environ. Technol., Kanazawa Univ., Ishikawa, Japan ; Yamada, S. ; Iwahara, M. ; Wakiwaka, H.
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High-density double-layer printed circuit board (PCB) inspection based on the eddy-current testing (ECT) technique is proposed in this paper. The ECT probe, which consisted of a planar meander exciting coil and spin-valve giant magnetoresistance (SV-GMR) sensor array, is used for this propose. Defects on both the top- and bottom-layer of the high-density double-layer PCB are examined by the ECT technique with scanning over either the top or bottom layer. The characteristics of the proposed ECT probe for high-density double-layer PCB inspection are studied. The inspection results of the high-density double-layer PCB model verify that applying the ECT technique enables identification of the defects of both the top and bottom layer with one-side scanning.

Published in:

Magnetics, IEEE Transactions on  (Volume:41 ,  Issue: 10 )

Date of Publication:

Oct. 2005

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