Cart (Loading....) | Create Account
Close category search window
 

Crosstalk attenuation with ground plane structures in three-dimensionally integrated mixed signal systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Kim, S.K.K. ; Dept. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA ; Liu, C.C. ; Lei Xue ; Tiwari, S.

We report significant crosstalk reduction between two transistor planes in 3D integrated circuits (3D ICs) using tungsten ground plane structures as the isolation layer. Simulation and experimental results show ∼8 dB of crosstalk attenuation. A significant conclusion of our study is that a ground plane that physically shadows the region it is isolating is optimum for deriving most of the benefits of isolation. We also show that for ground planes composed of standard MOS metallizations, i.e. W, Al, Cu, similar crosstalk isolation is expected. The inter-device ground plane structures have potential to be standard isolation technology for 3D mixed-signal and RF integrated systems due to simple fabrication and significant crosstalk attenuation.

Published in:

Microwave Symposium Digest, 2005 IEEE MTT-S International

Date of Conference:

12-17 June 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.