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Crosstalk improved three channel receiver module for 10 Gb/s parallel optical interconnect application

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2 Author(s)
Sang Hyun Park ; Sch. of Eng., Inf. & Commun. Univ., Daejeon, South Korea ; Chul Soon Park

Three channel optical receiver array with low inter-channel crosstalk is realized with InGaP/GaAs HBT technology and 3D multilayer low temperature cofiring ceramics (LTCC) module. The severe crosstalk in conventional on-chip bus module is explained especially at the frequency of 10 GHz. Neutralization feedback circuit with LTCC embedded bus structure is proposed to suppress significant high frequency crosstalk from conventional on-chip bus and inter-metallic capacitance. This new module structure demonstrates 5 dB better suppressed-coupling than a conventional on-chip bus module.

Published in:

Microwave Symposium Digest, 2005 IEEE MTT-S International

Date of Conference:

12-17 June 2005