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An 80 MHz digital signal processing multichip module made with the General Electric high density interconnect technology

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3 Author(s)
Gdula, M. ; GE Corp. Res. & Dev. Center, Schenectady, NY, USA ; Welles, K.B., II ; Wojnarowski, R.J.

A unique packaging and interconnect technology was used to build a multichip, four CPU element, pipeline parallel processing computer module using Texas Instruments TMS320C25 digital signal processors and companion circuits. The technology allowed a greater than fifteen-fold reduction in area over conventional chip packages mounted with printed-circuit-board methods. Reduced interconnect capacitance coupled with elimination of conventional package parasitics allowed clocking of commercial 40 MHz parts to nearly 90 MHz

Published in:

Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on

Date of Conference:

29-31 Jan 1991