By Topic

On the millimeter-wave characteristics and model of on-chip interconnect transmission lines up to 110 GHz

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

10 Author(s)

On-chip microstrip and coplanar waveguide structures were designed and fabricated in RF CMOS foundry processes. The wideband transmission line characteristics such as characteristic impedance, attenuation constant, propagation delay, and their electrical RLC parameters were evaluated based on S-parameter measurements in the millimeter-wave range. In addition, a SPICE-compatible RLC lumped element model including the skin-effect and the substrate RC network is employed to account for transmission line effects in interconnect over a wide frequency range up to 110 GHz.

Published in:

Microwave Symposium Digest, 2005 IEEE MTT-S International

Date of Conference:

12-17 June 2005