By Topic

Reliable matching of 300 mm defect inspection tools @ sub 60 nm defect size

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Nutsch, A. ; Fraunhofer Inst. Integrated Syst. & Device Technol., Erlangen, Germany ; Supplieth, F. ; Pfitzner, L. ; Ryssel, Heiner

This paper describes advanced methodologies for defect inspection studies and tool matching at sub 60 nm defect size. The methodologies were affirmed by experimental results achieved on different defect inspection systems designed for non-patterned wafers. The defect inspection has been described successfully by the binomial distribution. The reliability of matching of defect inspection systems was improved by using defect maps. It is anticipated that the methodologies will be applicable for defect inspection of both, patterned and non patterned wafers.

Published in:

Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on

Date of Conference:

13-15 Sept. 2005