We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Integrated metrology: the next generation in HVM

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kangas, E. ; Intel Corp., Rio Rancho, NM, USA ; Finkner, L.

Recent generation 193 nm lithography tools offer unique challenges for Intel and the semiconductor industry. Technologies are pushing the high volume manufacturing capability of critical dimension metrology tools in measurement and speed. The runrate for the latest generation lithography tools exceeds all previous generations by a wide margin requiring a change in metrology. How we respond to these challenges has far reaching implications for both our ability to successfully run new technologies in high volume as well as our ability to remain competitive in the marketplace. This paper will examine the case for integrated metrology (IM) for lithography as a technology driver that moves the industry towards adoption of integrated metrology as the next generation solution for lithography productivity.

Published in:

Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on

Date of Conference:

13-15 Sept. 2005