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A breakthrough in optimizing throughput and manufacturing efficiency via factory-wide dynamic WIP dispatching in 300mm semiconductor manufacturing

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4 Author(s)
Li, B. ; Intel Corp., Hillsboro, OR ; Wu, J. ; Herring, M.P. ; Mouli, C.

With the rapidly advancing semiconductor technology and competitive business conditions, it is very crucial to maintain high operation efficiency and maximize the key product throughput to supply market in a timely manner. Dynamic WIP (work in process) dispatching is a new technology to efficiently dispatch semiconductor manufacturing materials to desired tools for lot process promptly in response to dynamically changing operational and business needs. This paper describes how dynamic WIP dispatching capabilities are built on the next generation Manufacturing Execution System in Intel's manufacturing facilities, and employed in advanced 300 mm factories to significantly reduce throughput times, inventory levels, and labor overhead

Published in:

Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on

Date of Conference:

13-15 Sept. 2005