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GHGs reduction using the catalytic gas decomposition system

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2 Author(s)
Kinoshita, H. ; Renesas Eastern Japan Semicond. Inc., Gunma ; Matsuzaki, S.

The GHG emission reduction activity for the semiconductor factory has been described. As a result of the C2F6 gas and SF6 gas emission reduction countermeasures taken, the total GHG emissions could be reduced by 51% compared with 1995. The catalytic gas decomposition system was installed for SF6 gas, which was emitted from tungsten etching chamber. The SF6 gas decomposition ratio has been maintained at over 99.9% for one year. Regarding the degradation of the catalytic gas decomposition system (due to tungsten etching process by-products), analysis indicates that the dry trapping equipment introduction improved the maintenance interval by more than one year. As a result, a low running cost could be achieved

Published in:

Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on

Date of Conference:

13-15 Sept. 2005

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