Cart (Loading....) | Create Account
Close category search window
 

Imaging of steel reinforcement bars using planar electromagnetic induction tomography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Bissessur, Y. ; Mauritius Univ., Reduit, Mauritius ; Bhurtun, C.

Electromagnetic induction tomography (EMT) is a non-invasive imaging technique for determining the conductivity and magnetic permeability distributions in a region of interest (ROI), from measurement of inductances at its boundary. This paper describes how this technique may be used for imaging steel reinforcement bars embedded in a nonconducting and non-magnetic medium, from measurements made on only one side of the ROI. Reconstruction of the ROI is first carried out using the simultaneous increment reconstruction technique (STRT), which gives a crude estimate of the position and size of the reinforcement bars. These estimates are then refined using a non-linear reconstruction technique based on a parametric representation of the ROI.

Published in:

Computational Cybernetics, 2005. ICCC 2005. IEEE 3rd International Conference on

Date of Conference:

13-16 April 2005

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.