Accurate and scalable RF interconnect model for silicon-based RFIC applications

A new figure of merit, intrinsic factor for interconnects, is proposed to provide insights as to how back-end metallization influences the performance of radio frequency integrated circuits. An accurate and scalable double-/spl pi/ radio frequency interconnect model, continuous across physical dimensions of width and length, is presented to demonstrate reliable predictions of interconnect characteristics up to 10 GHz. Using this interconnect model in gigahertz amplifier and voltage-controlled oscillator circuit simulations yields excellent correlations between simulated and on-wafer measured circuit results.