By Topic

Dielectrophoretic assembly of carbon nanofiber nanoelectromechanical devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
S. Evoy ; Dept. of Electr. & Syst. Eng., Univ. of Pennsylvania, Philadelphia, PA, USA ; M. A. Riegelman ; N. Naguib ; Haihui Ye
more authors

We report a technique for the assembly of bottom-up nanomechanical devices. This technique employs the dielectrophoretic manipulation of nanostructures within a multiple layer lithography process. Mechanical resonators were specifically produced by assembling and clamping tubular carbon fibers onto prefabricated pads. Our preliminary results showed that an assembled cantilevered fiber with length L=5 μm and width of W=180 nm possessed a resonant frequency of f=1.17 MHz. A shorter L=3-μm-long singly clamped resonator of similar width showed a resonance of f=3.12 MHz. This frequency range is in agreement with the low gigapascal bending moduli previously reported for carbon structures showing extensive volume defects. This technology would allow the integration of bottom-up nanostructures with other more established fabrication processes, thus allowing the deployment of engineered nanodevices in integrated systems.

Published in:

IEEE Transactions on Nanotechnology  (Volume:4 ,  Issue: 5 )