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A low cost model utilising foam as an optimum sample backing has been used to measure the complex permittivity of thin packaging substrates over a broadband frequency of 0.1-20 GHz. Based on the open-ended coaxial line technique, the model validity has been verified both theoretically and experimentally, and a good accuracy is achieved. In addition, the model provides convenient probe calibration, thus enabling a fast extraction of the dielectric parameters utilising one port measurements. In particular, good agreement between the measured results and the manufacturer's data has been obtained, along with stable values of the material dielectric parameters over wide band frequencies. A good correlation has also been obtained between the measurement and simulation results over broadband.