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Measurement of acceleration factor for lead-free solder (SnAg3.8Cu0.7) in thermal cycling test of BGA components and calibration of lead-free solder joint model for life prediction by finite element analyses

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5 Author(s)
K. Andersson ; Nokia Res. Center, Nokia Group, Helsinki, Finland ; O. Salmela ; A. Perttula ; J. Sarkka
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Lead-free solder is taken into use in the electronics industry and there is a lack of data which shows how much thermal cycling tests accelerate the failure mechanisms compared to the real use conditions for the lead-free alloy. In this paper, a methodology on how to estimate the acceleration factor (AF) is described. The AF-experiments give an indication that the AF between the tests carried out at -40 - +125 °C and 30 - 80 °C is approximately 10 to 13. The test results have also been used to create a solder joint fatigue model for lead-free soldered BGA components. The model can be used to predict solder joint life by using finite element analyses in other environments.

Published in:

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005.

Date of Conference:

18-20 April 2005