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Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results

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4 Author(s)
Guedon-Gracia, A. ; ENSEIRB, Univ. Bordeaux 1, Talence, France ; Roux, P. ; Woirgard, E. ; Zardini, C.

Lead-free BGA assemblies are submitted to accelerated ageing test in order to determine the cycle number lead to the failure. The thermo-mechanical simulations are carried out on the assembly model in order to compute the strain energy density dissipated in the solder joints during the thermal cycles. Then the correlation between the experimentations and the simulations allows to predict the cycle number lead to the failure for another test.

Published in:

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Date of Conference:

18-20 April 2005