Scheduled System Maintenance on May 29th, 2015:
IEEE Xplore will be upgraded between 11:00 AM and 10:00 PM EDT. During this time there may be intermittent impact on performance. For technical support, please contact us at We apologize for any inconvenience.
By Topic

A cost-effective solution for packaging the arrayed waveguide grating (AWG) photonic components

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Zhiyi Zhang ; Inst. for Nat. Meas. Stand., Nat. Res. Council Canada, Ottawa, Ont., Canada ; Xiao, G.Z. ; Jiaren Liu ; Grover, C.P.
more authors

Precision laser machining technology was used to cut arrayed waveguide grating (AWG) devices from 6-in wafers by following their complex profiles in a fully automatic way. A substantial cost saving in components manufacturing was achieved by an obtained device-cutting yield of 100%. The profile-cut AWG devices have smooth cutting edges and their optical performances were found unaffected by the cutting. These devices were processed in the subsequent packaging process easily without adding cost. They were proven mechanically stable in their packaging in meeting the telecommunication standards even though they have irregular geometry.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:28 ,  Issue: 3 )