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Packaging of opto-electronic components - as opposed to semiconductor or electronics ICs - requires not only hermeticity but also proper alignment of optical elements. Due to tolerances in the range of a few microns at best, conventional technology usually requires laborious active alignment steps to couple light efficiently into the fiber. A simple optical coupling and alignment scheme is presented which enables the fabrication of cost effective 10 Gbit/s TOSA (transmitter optical sub-assembly) modules which are based on edge-emitting laser diodes packaged hermetically in micro-machined silicon structures.
Optical Fiber Communication Conference, 2005. Technical Digest. OFC/NFOEC (Volume:4 )
Date of Conference: 6-11 March 2005