Cart (Loading....) | Create Account
Close category search window

Low temperature interconnect technology using surface activated bonding (SAB) method

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Suga, T. ; Sch. of Eng., Univ. of Tokyo, Japan

SAB is a process for bonding surfaces which have been cleaned and activated by ion beam bombardment or plasma irradiation. The concept is based on the reactivity of atomically clean surfaces of solids and the formation of chemical bonds on contact between such clean and activated surfaces. The bonding procedure consists of cleaning followed by contact in ultra-high vacuum or in a certain ambient atmosphere. The highly activated surfaces enable them to bond to each other at a lower temperature than the conventional bonding process. This paper reviews the development and current status of the SAB process. A high-density bumpless interconnect for Cu electrodes (3 μm in diameter, 10 μm pitch) of 100,000 pieces at room temperature, and its application on the assembly of a flash memory card are demonstrated. Two new additional processes using a nano-layer adhesion and a sequential activation process are proposed for bonding of ionic materials such as SiO2, glass and LiNbO3.

Published in:

Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International

Date of Conference:

6-8 June 2005

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.