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Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

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3 Author(s)
Sun-Il Chang ; Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon, South Korea ; Hyung-Kew Lee ; Euisik Yoon

In this paper, the authors have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (anisotropic conductive paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.

Published in:

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.  (Volume:2 )

Date of Conference:

5-9 June 2005