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This paper describes the design, fabrication and testing of an electrostatically actuated microshutter used as an active shadow mask to pattern evaporated materials. The microshutter and its comb-drive actuator are built on the device layer of an SOI wafer. Deep reactive ion etching (DRIE) is used to pattern both the device layer and etch a through-wafer hole through which the evaporated materials travel. The actuation voltage of the device is about 30 volts, its resonant frequency is several kHz. The microshutter integrated with an x-y-z manipulator was used to print patterns of organic material and metal on glass substrates in vacuum with a resolution of 30 microns. This printing scheme could enable the patterning of large area organic optoelectronic devices on diverse substrates.