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We report an optimized process-induced strained silicon (PSS) technology for 90nm CMOS generation and beyond. Through the superposition of various PSS techniques, up to 20% performance enhancement is achieved for both N- and PMOS at channel length down to 45nm. The PSS technology exhibits excellent gate oxide breakdown characteristics, isolation characteristics and reliability. A novel spacer-PSS technology is also proposed for the first time and ∼7% enhancement in ring oscillator speed is observed.