By Topic

Wafer level self-assembly of microstructures using the global magnetic lifting and localized induction welding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hsueh-An Yang ; Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Chiung-Wen Lin ; Weileun Fang

This study has successfully demonstrated a process to localize assembly and weld microstructures using an external magnetic field. The primary three merits of this technology are: (1) the magnetic field is used not only to assemble the microstructures but also to fix them by induction welding; (2) the assembly and welding can be localized by the magnetic film; a global wafer level process can also be achieved by the magnetic field; (3) it is easy to tune the heating temperature by varying the area of magnetic film; in other words, the photolithography can define various temperature regions on the substrate.

Published in:

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.  (Volume:1 )

Date of Conference:

5-9 June 2005