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Wafer level self-assembly of microstructures using the global magnetic lifting and localized induction welding

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3 Author(s)
Hsueh-An Yang ; Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Chiung-Wen Lin ; Weileun Fang

This study has successfully demonstrated a process to localize assembly and weld microstructures using an external magnetic field. The primary three merits of this technology are: (1) the magnetic field is used not only to assemble the microstructures but also to fix them by induction welding; (2) the assembly and welding can be localized by the magnetic film; a global wafer level process can also be achieved by the magnetic field; (3) it is easy to tune the heating temperature by varying the area of magnetic film; in other words, the photolithography can define various temperature regions on the substrate.

Published in:

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on  (Volume:1 )

Date of Conference:

5-9 June 2005

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