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Effects of stress on the temperature coefficient of frequency in double clamped resonators

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7 Author(s)
Melamud, R. ; Dept. of Electr. & Mech. Eng., Stanford Univ., CA, USA ; Hopcroft, M. ; Jha, C. ; Bongsang Kim
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This paper presents a theoretical framework for evaluating the temperature coefficient of frequency (TCf) of double clamped resonators due to stresses induced by the die and through die packaging. It is desirable to have a zero TCf such that the resonator frequency is stable over a broad temperature range. The TCf depends on how the resonator's material properties, dimensions, and stresses change with temperature. A passive method of using thin film induced stresses in an encapsulated resonator to compensate for material softening is explored. By using a combination of finite element and analytical models it is possible to predict the TCf and improve thermal frequency stability of micromachined resonators.

Published in:

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on  (Volume:1 )

Date of Conference:

5-9 June 2005

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