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An ultra-low-power physics package for a chip-scale atomic clock

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3 Author(s)
Mescher, M.J. ; Charles Stark Draper Lab. Inc., Cambridge, MA, USA ; Lutwak, R. ; Varghese, M.

We report the design and measured thermal and mechanical performance of an ultra-low-power physics package for a chip-scale atomic clock (CSAC). This physics package enables communications and navigation systems that require a compact, low-power atomic frequency standard. The physics package includes a unique combination of thermal isolation, mechanical stability and robustness, and small package volume. We have demonstrated temperature control at a nominal operating temperature of 75°C in a room-temperature, vacuum ambient requiring only 7mW of heating power. This represents a power reduction of over two orders of magnitude compared to the lowest-power existing commercial technology and more than an order of magnitude improvement over other CSAC development efforts.

Published in:

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on  (Volume:1 )

Date of Conference:

5-9 June 2005

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