By Topic

Vibrating RF MEMS technology: fuel for an integrated micromechanical circuit revolution?

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Nguyen, C.T.-C. ; Microsystems Technol. Office, DARPA, Arlington, VA, USA

Having produced devices with sufficient Q, thermal stability, and manufacturability, for component-level use in present-day wireless handsets, vibrating RF MEMS technology is now poised to take its next logical steps: higher levels of circuit complexity and integration. In particular, as vibrating RF MEMS devices are perceived more as circuit building blocks than as standalone devices, and as the frequency processing circuits they enable become larger and more complex, the makings of an integrated micromechanical circuit technology begin to take shape, perhaps with a functional breadth to rival that of integrated transistor circuits. This paper suggests the mechanical circuit element properties that ensure a broad functional range for integrated micromechanical circuits.

Published in:

Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on  (Volume:1 )

Date of Conference:

5-9 June 2005