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Integration and innovation in the nanoelectronics era

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1 Author(s)
Sunlin Chou ; Technol. & Manuf. Group, Intel Corp., Hillsboro, OR, USA

Demand for electronics continues to grow as new products combine and enhance computing, communications, and digital capabilities. Hardware and software are evolving to enable new applications and usage modes, by offering features such as multitasking, parallel processing, mobility and wireless connectivity. Integration at both component and product platform levels, and efficient use of power, will become more important. These call for holistic solutions involving systems, circuits, processes, devices, and packaging. Many techniques to improve power efficiency have been developed and more will emerge. Silicon technology and scaling remain keys to progress, with transistors and circuit elements already at nanoscale dimensions. Innovation will accelerate as nanotechnology further renews and extends silicon technology. Skillful integration of new materials, processes, and device structures will be essential. Successful nanoelectronics companies will excel in innovation and integration, extend Moore's law into and beyond the next decade, and drive the development of future growth opportunities.

Published in:

Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International

Date of Conference:

10-10 Feb. 2005

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