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Efficient end point detection (EPD) in chemical mechanical planarization (CMP) is critical to quality and productivity of the wafer fabrication process. The cost of over and under polishing, and the cost of ownership of many expensive metrology-based EPD methods have motivated the researchers to seek cost effective and efficient alternatives. This paper presents a novel method for EPD, which uses a sequential probability ratio test (SPRT) on the wavelet decomposed coefficient of friction (CoF) data from the CMP process. The method is made suitable for online application by developing a moving block data processing strategy, which matches the rate of data acquisition. Tests on both oxide and copper metal CMP show that the developed methodology is uniquely capable of identifying the start and finish of the end point event.