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Wave soldering process for lead free solders - a modelling study using computational fluid dynamics

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5 Author(s)
Stoyanov, S. ; Sch. of Comput. & Math. Sci., Greenwich Univ., London ; Gwyer, D. ; Bailey, C. ; Saxena, N.
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Nitrogen is now used in wave soldering machines to help lower the amount of dross that can be formed on the solder bath surface. This paper provides details on the use of computational fluid dynamics (CFD) in helping understand the flow profiles of nitrogen in a wave soldering machine and to predict the concentration of nitrogen and oxygen around the solder bath

Published in:
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

Date of Conference: 0-0 0

Page(s):
476 - 479
Print ISBN:
0-7803-9325-2
INSPEC Accession Number:
8689144
Conference Location :
Wiener Neustadt
Digital Object Identifier :
10.1109/ISSE.2005.1491075
Product Type:
Conference Publications

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