By Topic

Heat sink materials with tailored properties for thermal management

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
E. Neubauer ; Mater. Res., ARC Seibersdorf Res. GmbH ; P. Angerer ; G. Korb

This paper summarizes a part of the research work done at ARC Seibersdorf research during the past years related to the development of heat sink materials with tailored thermophysical properties. By using copper as a matrix material in combination with reinforcements with a low coefficient of thermal expansion a broad range of material properties can be achieved. The influence of processing conditions, type of the reinforcement as well as the variation of the volume content of the reinforcement allows tailoring the properties. Materials with such properties are of interest for use as a heat sink material. Of course there are problems to solve, especially if high thermally conductive reinforcements are used. These problems are addressed and possible solutions are explained

Published in:

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005.

Date of Conference:

0-0 0