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A compact radio system module, 10×10.3×1.2 mm3, for triple-band GSM cellular phones is presented. The module was miniaturized by employing a simple front-end architecture, highly integrated transceiver IC, one chip HPA-MMIC, and thin four-layer laminate substrate. Design considerations for a very compact radio system module, i.e., techniques for avoiding thermal and electrical interaction, are discussed. The excellent performance of the developed module, which is reflected in its high thermal and electrical isolation, is demonstrated.