By Topic

Numerical optimisation of flow-rate microsensors using circuit simulation tools

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Swart, N. ; Electr. & Comput. Eng., Waterloo Univ., Ont., Canada ; Nathan, A. ; Shams, M. ; Parameswaran, M.

Numerical simulation results of the steady state thermal behavior in flow-rate microsensors are presented. The results have been obtained using a circuit level CAD (computer-aided design) tool. The various heat transfer mechanisms are suitably reduced into a circuit model by using the linear and nonlinear circuit elements available in SPICE. Good agreement between simulations and measurements has been obtained for realistic values of physical parameters. Both laminar and turbulent gas flow conditions are considered.<>

Published in:

Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on

Date of Conference:

24-27 June 1991