We describe a high-performance fully ion-implanted planar InP junction FET fabricated by a shallow (4000-Å) n-channel implant, an n+source-drain implant to reduce FET series resistance, and a p-gate implant to form a shallow (2000-Å) abrupt p-n junction, followed by a rapid thermal activation. From FET's with gates 2 µm long, a transconductance of 50 mS/mm and an output impedance of 400 Ω.mm are measured at zero gate bias with a gate capacitance of 1.2 pF/mm. The FET has a threshold voltage of -2.4 V, and a saturated drain current of 60 mA/mm at V
Published in:
Electron Device Letters, IEEE
(Volume:8
,
Issue:
11
)
Date of Publication: Nov 1987