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1800V bipolar-mode MOSFETs: A first application of silicon wafer direct bonding (SDB) technique to a power device

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5 Author(s)
Nakagawa, A. ; Toshiba Research and Development Center, Kawasaki, Japan ; Watanabe, K. ; Yamaguchi, Y. ; Ohashi, Hiromichi
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1800v and 1700v non-latch-up Bipolar-Mode MOSFETs have been developed, based on Silicon Wafer Direct Bonding (SDB) technique: a new substrate wafer fabrication process superior to conventional epitaxy. The SDB technique easily realizes an optimum N buffer structure as well as a high resistivity N-layer. Self-aligned deep P+diffusions, densified hole bypasses and an amorphous silicon resistive field plate have been implemented. 0.45µsec fall-time and more than 100A maximum current capability have been successfully realized.

Published in:

Electron Devices Meeting, 1986 International  (Volume:32 )

Date of Conference:

1986