Composite silicided source-drains are being developed to provide low-resistance shallow junctions for high performance fine-line circuits. The junctions are usually formed either by implantation and drive prior to silicide formation or else by implantation immediately after, followed by a heat cycle. This paper describes a novel approach for the fabrication of CoSi2/n+-p junctions (2 . 5 Ω/□ sheet resistance), wherein the junctions are doped by diffusion through the contact windows using the conventional "poly-plug" doping cycle , . LPCVD poly-Si is deposited on windows to previously silicided gate and source-drain regions, and exposed to PBr3at an elevated temperature. Since the diffusivity of dopants in silicides is higher than in bulk Si, this step transports the P through the poly-Si via the windows laterally into the silicide, to form uniformly doped junction surrounds. This poly-Si doping scheme for junction fabrication eliminates an ion-implant step, provides an independent means of tailoring channel length, and can potentially result in low-resistance contacts even if the window etch step has punched through the silicide, Electrical characteristics of 1.25-µm gate-length ring oscillators are similar to those of circuits processed with the conventional As implant and drive. Transistor 's and subthreshold behavior remain unaffected by the silicide doping process. Junction depth and leakage are sensitive functions of the poly-plug thermal cycle, with a 950°C 30-min drive resulting in 0.3-µm junctions. For a 1-µm design rule circuit layout, 30 to 45 min at 950°C is judged adequate.