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The UV-excited phosphor plasma display is a promising technology for large area high-resolution color displays. The incorporation of multi-phosphor arrays in such displays requires the use of UV isolation barriers for effective color separation. The resolution limitations of current thick-film technology necessitate the development of new approaches to the fabrication of high density, high resolution barrier structures for flat display devices. A processing technique for the patterning of lead-bearing thick film dielectrics via selective chemical etching in fluoboric acid is presented, which makes possible the fabrication of dielectric barriers 0.025 mm wide and 0.025 mm high for full-color plasma displays with increased resolution.