By Topic

Designs of low stress I/O pin attach structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

14 Author(s)
D. -Y. Shih ; IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA ; P. Palmateer ; Y. Fu ; J. Kim
more authors

Three low-stress pin attachment structures were developed for the glass ceramic-copper multilayer ceramic (MLC) packaging technology used in IBM ES 9000 processors. The structures include the multilayer thin-film I/O pads, taper-headed pin and low-stress solder as the joining alloy. All of them were shown to reduce the pin-joint stress significantly and, consequently, are more compatible with the glass-ceramic module. The authors summarize both experimental and finite-element analysis studies to optimize the stress of the pin-attach system such that the pins can be joined to the glass-ceramic MLC with good reliability. The design goal was to have a pin-joint structure in which the ceramic and the pin-joint will survive a pin-pull test up to 10 lbs with a repairable pin-shank failure mode. The combined stresses generated from the braze, pin loading, and I/O pad should not exceed the fracture strength of the ceramic substrate. Finite-element modeling identified high-stress regions and possible failure modes of each pin joint design. The three approaches taken to reduce the stress of the pin-joint are described

Published in:

IEEE Transactions on Components, Hybrids, and Manufacturing Technology  (Volume:15 ,  Issue: 3 )