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AN EHF backplate design for airborne active phased array antennas

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7 Author(s)
H. Wong ; Hughes Aircraft Co., El Segundo, CA, USA ; S. S. Chang ; D. C. D. Chang ; G. S. Bretana
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An EHF array backplate design for use in airborne active phase array antennas is described. The backplate utilizes a multilayer substrate and reduced waveguide for signal routing, while a counterflow air cooling technique is used to cool the GaAs monolithic microwave integrated circuit (MMIC) active devices. The integrated design is characterized by temperature-coefficient-matched materials to insure a rigid, thermally stable structure.<>

Published in:

Microwave Symposium Digest, 1991., IEEE MTT-S International

Date of Conference:

10-14 July 1991