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Dynamic SIMS study on failure analysis of multiple E-test failure in wafer fabrication

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5 Author(s)
Gui, D ; Chartered Semicond. Mfg. Ltd., Singapore ; Hua, Y.N. ; Eng, C.S. ; Ooi, S.C.
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A case of multiple failures at the end of line (EOL) electrical test (E-test) was encountered in wafer fabrication. In this paper, we will present a significant study of multiple E-test failure case, using CAMECA IMS Wf instrument. The results show that the failure is relate to the quality of incoming starting materials.

Published in:
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the

Date of Conference: 27 June-1 July 2005

Page(s):
205 - 208
Print ISBN:
0-7803-9301-5
INSPEC Accession Number:
8624182
Digital Object Identifier :
10.1109/IPFA.2005.1469162
Product Type:
Conference Publications

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