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Flexible electronics are increasingly being used in a number of applications which benefit from their low profile, light weight, and favorable dielectric properties. However, despite these advantages, the range of practical, high-volume, applications for flexible electronics will remain limited in the future unless a number of challenges related to lithographic patterning on flexible substrates are successfully addressed. The most critical of these pertain to system parameters that affect the cost and performance of flexible circuits, including the resolution, panel size, process throughput, substrate distortion, material handling, and yield. We present a new class of roll-to-roll lithography systems, developed in recent years, that were designed to address the challenges in each of these critical areas. These systems provides high-resolution projection imaging over very large exposure areas, on flexible substrate materials. Additionally, they achieve high-precision alignment by means of image scaling to compensate for substrate distortion due to processing; and they also performs high-throughput photoablation, patterning millions of pixels simultaneously, by means of projection imaging. This technology is attractive for current and emerging applications, such as flexible circuit boards and flexible chip carriers, as well as for potential future applications such as such as flexible displays and macroelectronic systems.